Manufacturing

We are bringing together participants from government, forensic laboratories, industry, academia, law enforcement agencies, and standards organizations to foster an open and candid discussion for a broad view of the path forward to realize meaningful

The Open Industrial Digital Ecosystem Summit is an annual event bringing together thought leaders, experts, practitioners, developers, and users of standards for data semantics. The event is co-hosted by the Systems Integration Division of the

The U.S. Department of Commerce, National Institute of Standards and Technology (NIST) and the International Ultraviolet Association (IUVA) invite you to their jointly hosted workshop: “Advancing Ultraviolet (UV) Germicidal Efficacy Measurement

The 2025 MBE & QIF Summit event is returning to MxD (Manufacturing x Digital) headquarters in Chicago, IL, April 15 – 17, 2025. Registration opened on January 20, 2025. A link to registration can be found at on the Summit webpage https://qifstandards

Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded Corning up to $32 million in direct funding, it awarded Edwards Vacuum up to $18 million in direct funding, and it awarded Infinera up to $93 million in direct funding. The awards come after the previously signed preliminary memoranda of terms, announced on November 8, 2024, October 10, 2024, and October 17, 2024, respectively, and the completion of the Department’s due diligence. The Department will disburse the funds based on the companies’ completion of project milestones.

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing. These awards will help establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States.

Today, the U.S. Department of Commerce announced the signing of four separate non-binding preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide up to $105 million in proposed direct funding to Analog Devices, Inc. (“ADI”), up to $79 million in proposed direct funding to Coherent, up to $10.3 million in proposed direct funding to Intelligent Epitaxy Technology, Inc. (“IntelliEPI), and up to $52.1 million in proposed direct funding to Sumika Semiconductor Materials Texas Inc., (“Sumika”).

Today, the U.S. Department of Commerce announced the National Institute of Standards and Technology (NIST) has awarded Natcast up to $6.3 billion to operate the National Semiconductor Technology Center (NSTC) under a long-term agreement with NIST. Through this partnership, Natcast will continue to build the NSTC as an enduring institution that will extend U.S. leadership in semiconductor technology, reduce the time and cost to prototype, and build and sustain a semiconductor workforce ecosystem, consistent with the vision laid out in the CHIPS and Science Act. This award follows the previously announced intent to invest over $5 billion in the NSTC.

Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (“MACOM”) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act. The proposed CHIPS funding would support the expansion and modernization of MACOM’s facilities in Lowell, Massachusetts, and Durham, North Carolina, and would create up to 350 manufacturing jobs and nearly 60 construction jobs across both states.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. This award will support the expansion and modernization of the existing facility of HP Inc. (“HP”) in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (R&D) activities to commercial manufacturing operations, and serves as one of three R&D Centers for Excellence within the company’s global footprint.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities

Picture this: You have a bag of heavily used clothes that can no longer be donated taking up space in your closet, so you drop it off at your local recycling center. But what happens to that bag of clothes? You might assume that the clothes would get

Some people like plastic Christmas trees; others prefer real wood and needles. This year, NIST is printing a tree out of concrete. The tree is not only festive; it’s also a test of the printing process and the skill of NIST researchers. 3D-printed

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities. The award follows the previously signed preliminary memorandum of terms, announced on April 15, 2024, and the completion of the Department’s due diligence. This funding will support Samsung’s investment of over $37 billion in the coming years to turn its existing presence in Central Texas into a comprehensive ecosystem for the development and production of leading-edge chips in the United States, including two new leading-edge logic fabs and an R&D fab in Taylor, as well as an expansion to their existing Austin facility. The Department will distribute the funds based on Samsung’s completion of project milestones.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on August 16, 2024, and the completion of the Department’s due diligence. This funding will support TI’s investment of more than $18 billion through the end of the decade to construct three new state-of-the-art facilities, including two in Texas and one in Utah. The Department will distribute the funds based on TI’s completion of project milestones.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co., Ltd. (GlobalWafers), of up to $406 million under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The awards come after the previously signed preliminary memorandum of terms, announced on July 17, 2024, and the completion of the Department’s due diligence. The Department will disburse the funds based on the completion of project milestones by GWA and MEMC.

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Bosch have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $225 million in proposed direct funding under the CHIPS and Science Act

CHIPS Award Will Support Micron’s 20-year Manufacturing Vision to Expand Leading-Edge DRAM Production in Idaho and New York CHIPS PMT Would Support Expansion of Virginia Facility to Onshore Important Memory Production Today, the Biden-Harris